Control of a two-thermoelectric-cooler system for ice-clamping application using Lyapunov based approach

Research output: Contributions to collected editions/worksArticle in conference proceedingsResearchpeer-review

Authors

Homogeneous cooling of a metallic plate with the help of thermoelectric elements is crucial in terms of using it as a clamping device. By applying water on a plate and chilling it under sub-zero temperatures the resulting ice structure is able to fix workpieces form-fitted, ensuring proper holding and clamping forces for upcoming machining operations. For this purpose a number of thermoelectric coolers (TECs) need to be controlled such that a homogeneous temperature profile on the clamping plate is guaranteed as well as the prevention of thawing, especially if external thermal disturbances occur due to machining processes like drilling, turning or milling. To face these challenges a robust controller is designed based on the Lyapunov Theory, proving its asymptomatic stability by means of two sliding surfaces. A clamping system consisting of two TECs, an aluminium clamping plate and a heat sink with forced convection is chosen for simulation purposes. This paper shows the model of such a system with corresponding controller design as well as the simulation results of the control strategy.

Original languageEnglish
Title of host publicationProceedings of the 2017 21st International Conference on Process Control (PC)
EditorsM. Fikar, M. Kvasnica
Number of pages6
PublisherIEEE - Institute of Electrical and Electronics Engineers Inc.
Publication date11.07.2017
Edition1
Pages24-29
ISBN (print)978-1-5386-4012-8
ISBN (electronic)978-1-5386-4011-1
DOIs
Publication statusPublished - 11.07.2017
Event21st International Conference on Process Control - PC 2017 - Strbske Pleso, Slovakia
Duration: 06.06.201709.06.2017
Conference number: 21
https://www.uiam.sk/pc17/index.html%3Fq=node%252F1.html

    Research areas

  • Control of manufacturing, ice-clamping applications, Lyapunov approach
  • Engineering

DOI