Effect of Temperature and Strain Rate on Formability of Titanium Alloy KS1.2ASN

Publikation: Beiträge in SammelwerkenAufsätze in KonferenzbändenForschungbegutachtet

Authors

Titanium alloys are widely used in aerospace and automotive industries due to their excellent mechanical properties, however, the formability is limited, which is an issue during forming. In the present study, the effect of temperature and strain rate on the tensile properties of the titanium α-alloy KS1.2ASN was investigated. It was observed that there is initially no gain in ductility with increase in temperature until 400 °C, however, maximum formability is reached at maximum tested temperature of 600 °C. EBSD analysis revealed that twinning is the main deformation mechanism at room temperature, however, deformation becomes more pronounced with increasing temperature. An increase in strain rate leads to a decrease in elongation, but the influence is less pronounced compared to temperature.

OriginalspracheEnglisch
TitelAchievements and Trends in Material Forming : Peer-reviewed extended papers selected from the 25 th International Conference on Material Forming (ESAFORM 2022)
HerausgeberGabriela Vincze, Frédéric Barlat
Anzahl der Seiten8
ErscheinungsortBaech
VerlagTrans Tech Publications Ltd
Erscheinungsdatum22.07.2022
Seiten939-946
ISBN (Print)978-3-0357-1759-4
ISBN (elektronisch)978-3-0357-3750-9
DOIs
PublikationsstatusErschienen - 22.07.2022
VeranstaltungConference - 25th International Conference on Material Forming, ESAFORM 2022 - Altice Forum Braga, Braga, Portugal
Dauer: 27.04.202229.04.2022
Konferenznummer: 25
https://esaform2022.org/

Bibliographische Notiz

Funding Information:
This work was carried out within the framework of an EU Project and was funded by the European Union (Clean Sky 2 EU JTI Platform) under the thematic call JTI-CS2-2019-CfP10-LPA-01-83 “Forming of microperforated outer skin of HLFC wings assisted by FEM simulation/MICROFORM” (grant agreement no: 886409).

Publisher Copyright:
© 2022 The Author(s). Published by Trans Tech Publications Ltd, Switzerland.

DOI