Integration of laser scanning and projection speckle pattern for advanced pipeline monitoring

Research output: Contributions to collected editions/worksArticle in conference proceedingsResearchpeer-review

Authors

  • J. Fabián Villa-Manríquez
  • Oleg Sergiyenko
  • Cesar Sepúlveda-Valdez
  • Ruben Alaniz-Plata
  • José A. Núñez-López
  • Paolo Mercorelli
  • Wendy Flores-Fuentes
  • Julio C. Rodriguez-Quiñonez
  • Vera Tyrsa
  • David Meza-Garcia
  • Fernando López-Medina
  • Humberto Andrade-Collazo
  • Moises Jesus Castro-Toscano

non-contact 3D spatial coordinate measurement systems, based on optical laser scanning as technical vision systems (TVS) for signal processing, are essential methodologies for obtaining topographies in high-risk environments where human exploration is limited. However, these systems have limitations in resolution, particularly when addressing features such as surface texture and small curvatures at edges. Therefore, in this work, we propose the implementation of speckle pattern projection as a complementary innovative solution. Supported by the digital image correlation (DIC) methodology and the use of multivariate methods such as principal component analysis (PCA), we obtain results from different wall surfaces in a pipe prototype. Additionally, we analyze the behavior of the signal received by the 3D scanner sensor, which provides complementary information about the study surface. This demonstrates that the combination of speckle pattern projection and three-dimensional laser scanning is an additional tool for advanced detection of substance material during pipeline monitoring.

Original languageEnglish
Title of host publicationIECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society : Proceedings
Number of pages6
Place of PublicationPiscataway
PublisherIEEE - Institute of Electrical and Electronics Engineers Inc.
Publication date2024
ISBN (print)978-1-6654-6455-0
ISBN (electronic)978-1-6654-6454-3
DOIs
Publication statusPublished - 2024
Event50th Annual Conference of the IEEE Industrial Electronics Society - IECON 2024 - Chicago, United States
Duration: 03.11.202406.11.2024
Conference number: 50
https://www.iecon-2024.org/

Bibliographical note

Publisher Copyright:
© 2024 IEEE.

    Research areas

  • 3D scanning, automated guide vehicle, digital image correlation, principal component analysis, reflection, speckle, technical vision system
  • Engineering

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