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Integration of laser scanning and projection speckle pattern for advanced pipeline monitoring

Publikation: Beiträge in Sammelwerken › Aufsätze in Konferenzbänden › Forschung › begutachtet

Standard

Integration of laser scanning and projection speckle pattern for advanced pipeline monitoring. / Villa-Manríquez, J. Fabián; Sergiyenko, Oleg; Sepúlveda-Valdez, Cesar et al.
IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society: Proceedings. Piscataway: IEEE - Institute of Electrical and Electronics Engineers Inc., 2024. (IECON Proceedings (Industrial Electronics Conference)).

Publikation: Beiträge in Sammelwerken › Aufsätze in Konferenzbänden › Forschung › begutachtet

Harvard

Villa-Manríquez, JF, Sergiyenko, O, Sepúlveda-Valdez, C, Alaniz-Plata, R, Núñez-López, JA, Mercorelli, P, Flores-Fuentes, W, Rodriguez-Quiñonez, JC, Tyrsa, V, Meza-Garcia, D, López-Medina, F, Andrade-Collazo, H & Castro-Toscano, MJ 2024, Integration of laser scanning and projection speckle pattern for advanced pipeline monitoring. in IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society: Proceedings. IECON Proceedings (Industrial Electronics Conference), IEEE - Institute of Electrical and Electronics Engineers Inc., Piscataway, 50th Annual Conference of the IEEE Industrial Electronics Society - IECON 2024, Chicago, Illinois, USA / Vereinigte Staaten, 03.11.24. https://doi.org/10.1109/IECON55916.2024.10905742

APA

Villa-Manríquez, J. F., Sergiyenko, O., Sepúlveda-Valdez, C., Alaniz-Plata, R., Núñez-López, J. A., Mercorelli, P., Flores-Fuentes, W., Rodriguez-Quiñonez, J. C., Tyrsa, V., Meza-Garcia, D., López-Medina, F., Andrade-Collazo, H., & Castro-Toscano, M. J. (2024). Integration of laser scanning and projection speckle pattern for advanced pipeline monitoring. In IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society: Proceedings (IECON Proceedings (Industrial Electronics Conference)). IEEE - Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IECON55916.2024.10905742

Vancouver

Villa-Manríquez JF, Sergiyenko O, Sepúlveda-Valdez C, Alaniz-Plata R, Núñez-López JA, Mercorelli P et al. Integration of laser scanning and projection speckle pattern for advanced pipeline monitoring. in IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society: Proceedings. Piscataway: IEEE - Institute of Electrical and Electronics Engineers Inc. 2024. (IECON Proceedings (Industrial Electronics Conference)). doi: 10.1109/IECON55916.2024.10905742

Bibtex

@inbook{1d0ce50daf004080a86d26f03143fea7,
title = "Integration of laser scanning and projection speckle pattern for advanced pipeline monitoring",
abstract = "non-contact 3D spatial coordinate measurement systems, based on optical laser scanning as technical vision systems (TVS) for signal processing, are essential methodologies for obtaining topographies in high-risk environments where human exploration is limited. However, these systems have limitations in resolution, particularly when addressing features such as surface texture and small curvatures at edges. Therefore, in this work, we propose the implementation of speckle pattern projection as a complementary innovative solution. Supported by the digital image correlation (DIC) methodology and the use of multivariate methods such as principal component analysis (PCA), we obtain results from different wall surfaces in a pipe prototype. Additionally, we analyze the behavior of the signal received by the 3D scanner sensor, which provides complementary information about the study surface. This demonstrates that the combination of speckle pattern projection and three-dimensional laser scanning is an additional tool for advanced detection of substance material during pipeline monitoring.",
keywords = "3D scanning, automated guide vehicle, digital image correlation, principal component analysis, reflection, speckle, technical vision system, Engineering",
author = "Villa-Manr{\'i}quez, {J. Fabi{\'a}n} and Oleg Sergiyenko and Cesar Sep{\'u}lveda-Valdez and Ruben Alaniz-Plata and N{\'u}{\~n}ez-L{\'o}pez, {Jos{\'e} A.} and Paolo Mercorelli and Wendy Flores-Fuentes and Rodriguez-Qui{\~n}onez, {Julio C.} and Vera Tyrsa and David Meza-Garcia and Fernando L{\'o}pez-Medina and Humberto Andrade-Collazo and Castro-Toscano, {Moises Jesus}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 50th Annual Conference of the IEEE Industrial Electronics Society - IECON 2024, IECON 2024 ; Conference date: 03-11-2024 Through 06-11-2024",
year = "2024",
doi = "10.1109/IECON55916.2024.10905742",
language = "English",
isbn = "978-1-6654-6455-0",
series = "IECON Proceedings (Industrial Electronics Conference)",
publisher = "IEEE - Institute of Electrical and Electronics Engineers Inc.",
booktitle = "IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society",
address = "United States",
url = "https://www.iecon-2024.org/",

}

RIS

TY - CHAP

T1 - Integration of laser scanning and projection speckle pattern for advanced pipeline monitoring

AU - Villa-Manríquez, J. Fabián

AU - Sergiyenko, Oleg

AU - Sepúlveda-Valdez, Cesar

AU - Alaniz-Plata, Ruben

AU - Núñez-López, José A.

AU - Mercorelli, Paolo

AU - Flores-Fuentes, Wendy

AU - Rodriguez-Quiñonez, Julio C.

AU - Tyrsa, Vera

AU - Meza-Garcia, David

AU - López-Medina, Fernando

AU - Andrade-Collazo, Humberto

AU - Castro-Toscano, Moises Jesus

N1 - Conference code: 50

PY - 2024

Y1 - 2024

N2 - non-contact 3D spatial coordinate measurement systems, based on optical laser scanning as technical vision systems (TVS) for signal processing, are essential methodologies for obtaining topographies in high-risk environments where human exploration is limited. However, these systems have limitations in resolution, particularly when addressing features such as surface texture and small curvatures at edges. Therefore, in this work, we propose the implementation of speckle pattern projection as a complementary innovative solution. Supported by the digital image correlation (DIC) methodology and the use of multivariate methods such as principal component analysis (PCA), we obtain results from different wall surfaces in a pipe prototype. Additionally, we analyze the behavior of the signal received by the 3D scanner sensor, which provides complementary information about the study surface. This demonstrates that the combination of speckle pattern projection and three-dimensional laser scanning is an additional tool for advanced detection of substance material during pipeline monitoring.

AB - non-contact 3D spatial coordinate measurement systems, based on optical laser scanning as technical vision systems (TVS) for signal processing, are essential methodologies for obtaining topographies in high-risk environments where human exploration is limited. However, these systems have limitations in resolution, particularly when addressing features such as surface texture and small curvatures at edges. Therefore, in this work, we propose the implementation of speckle pattern projection as a complementary innovative solution. Supported by the digital image correlation (DIC) methodology and the use of multivariate methods such as principal component analysis (PCA), we obtain results from different wall surfaces in a pipe prototype. Additionally, we analyze the behavior of the signal received by the 3D scanner sensor, which provides complementary information about the study surface. This demonstrates that the combination of speckle pattern projection and three-dimensional laser scanning is an additional tool for advanced detection of substance material during pipeline monitoring.

KW - 3D scanning

KW - automated guide vehicle

KW - digital image correlation

KW - principal component analysis

KW - reflection

KW - speckle

KW - technical vision system

KW - Engineering

UR - http://www.scopus.com/inward/record.url?scp=105000936586&partnerID=8YFLogxK

U2 - 10.1109/IECON55916.2024.10905742

DO - 10.1109/IECON55916.2024.10905742

M3 - Article in conference proceedings

AN - SCOPUS:105000936586

SN - 978-1-6654-6455-0

T3 - IECON Proceedings (Industrial Electronics Conference)

BT - IECON 2024 - 50th Annual Conference of the IEEE Industrial Electronics Society

PB - IEEE - Institute of Electrical and Electronics Engineers Inc.

CY - Piscataway

T2 - 50th Annual Conference of the IEEE Industrial Electronics Society - IECON 2024

Y2 - 3 November 2024 through 6 November 2024

ER -

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DOI

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