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A Stacked Planar Sensor Concept for Minimally Invasive Plasma Monitoring

Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review

Standard

A Stacked Planar Sensor Concept for Minimally Invasive Plasma Monitoring. / Pohle, Dennis; Schulz, Christian; Oberberg, Moritz et al.
2018 Asia-Pacific Microwave Conference, APMC 2018 - Proceedings. Piscataway: IEEE - Institute of Electrical and Electronics Engineers Inc., 2019. p. 1315-1317 8617552 (Asia-Pacific Microwave Conference Proceedings, APMC; Vol. 2018-November).

Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review

Harvard

Pohle, D, Schulz, C, Oberberg, M, Friedrichs, M, Serwa, A, Uhlig, P, Oberrath, J, Awakowicz, P & Rolfes, I 2019, A Stacked Planar Sensor Concept for Minimally Invasive Plasma Monitoring. in 2018 Asia-Pacific Microwave Conference, APMC 2018 - Proceedings., 8617552, Asia-Pacific Microwave Conference Proceedings, APMC, vol. 2018-November, IEEE - Institute of Electrical and Electronics Engineers Inc., Piscataway, pp. 1315-1317, 30th Asia-Pacific Microwave Conference 2018, Kyoto, Japan, 06.11.18. https://doi.org/10.23919/APMC.2018.8617552

APA

Pohle, D., Schulz, C., Oberberg, M., Friedrichs, M., Serwa, A., Uhlig, P., Oberrath, J., Awakowicz, P., & Rolfes, I. (2019). A Stacked Planar Sensor Concept for Minimally Invasive Plasma Monitoring. In 2018 Asia-Pacific Microwave Conference, APMC 2018 - Proceedings (pp. 1315-1317). Article 8617552 (Asia-Pacific Microwave Conference Proceedings, APMC; Vol. 2018-November). IEEE - Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/APMC.2018.8617552

Vancouver

Pohle D, Schulz C, Oberberg M, Friedrichs M, Serwa A, Uhlig P et al. A Stacked Planar Sensor Concept for Minimally Invasive Plasma Monitoring. In 2018 Asia-Pacific Microwave Conference, APMC 2018 - Proceedings. Piscataway: IEEE - Institute of Electrical and Electronics Engineers Inc. 2019. p. 1315-1317. 8617552. (Asia-Pacific Microwave Conference Proceedings, APMC). doi: 10.23919/APMC.2018.8617552

Bibtex

@inbook{2fc6693b588641f4bb15732f5b3a89ee,
title = "A Stacked Planar Sensor Concept for Minimally Invasive Plasma Monitoring",
abstract = "A novel advanced design of the planar multipole resonance probe (pMRP) using LTCC-technology is investigated in this contribution. Integrated into the reactor wall, the planar sensor structure enables a minimally invasive in-situ plasma monitoring. Due to the ceramic substrate material, a substantial improved resistance against high temperatures can be achieved, extending the potential fields of application. The used multilayer structure with vertically stacked components ensures a high level of integration and further enhances the mechanical robustness leading to an industry compatible plasma sensor design. The probe is investigated within 3D electromagnetic simulations and its applicability is demonstrated by measurements in a double inductively coupled plasma (DICP).",
keywords = "Engineering, Multipole resonance probe, Plasma diagnostics",
author = "Dennis Pohle and Christian Schulz and Moritz Oberberg and Michael Friedrichs and Alexandra Serwa and Peter Uhlig and Jens Oberrath and Peter Awakowicz and Ilona Rolfes",
note = "Copyright 2018 IEICE, Date Added to IEEE Xplore: 17 January 2019 ; 30th Asia-Pacific Microwave Conference 2018 : Harmonious World Connected by Microwaves, APMC 2018 ; Conference date: 06-11-2018 Through 09-11-2018",
year = "2019",
month = jan,
day = "16",
doi = "10.23919/APMC.2018.8617552",
language = "English",
isbn = "978-1-5386-2184-4 ",
series = "Asia-Pacific Microwave Conference Proceedings, APMC",
publisher = "IEEE - Institute of Electrical and Electronics Engineers Inc.",
pages = "1315--1317",
booktitle = "2018 Asia-Pacific Microwave Conference, APMC 2018 - Proceedings",
address = "United States",
url = "http://www.apmc2018.org/",

}

RIS

TY - CHAP

T1 - A Stacked Planar Sensor Concept for Minimally Invasive Plasma Monitoring

AU - Pohle, Dennis

AU - Schulz, Christian

AU - Oberberg, Moritz

AU - Friedrichs, Michael

AU - Serwa, Alexandra

AU - Uhlig, Peter

AU - Oberrath, Jens

AU - Awakowicz, Peter

AU - Rolfes, Ilona

N1 - Conference code: 30

PY - 2019/1/16

Y1 - 2019/1/16

N2 - A novel advanced design of the planar multipole resonance probe (pMRP) using LTCC-technology is investigated in this contribution. Integrated into the reactor wall, the planar sensor structure enables a minimally invasive in-situ plasma monitoring. Due to the ceramic substrate material, a substantial improved resistance against high temperatures can be achieved, extending the potential fields of application. The used multilayer structure with vertically stacked components ensures a high level of integration and further enhances the mechanical robustness leading to an industry compatible plasma sensor design. The probe is investigated within 3D electromagnetic simulations and its applicability is demonstrated by measurements in a double inductively coupled plasma (DICP).

AB - A novel advanced design of the planar multipole resonance probe (pMRP) using LTCC-technology is investigated in this contribution. Integrated into the reactor wall, the planar sensor structure enables a minimally invasive in-situ plasma monitoring. Due to the ceramic substrate material, a substantial improved resistance against high temperatures can be achieved, extending the potential fields of application. The used multilayer structure with vertically stacked components ensures a high level of integration and further enhances the mechanical robustness leading to an industry compatible plasma sensor design. The probe is investigated within 3D electromagnetic simulations and its applicability is demonstrated by measurements in a double inductively coupled plasma (DICP).

KW - Engineering

KW - Multipole resonance probe

KW - Plasma diagnostics

UR - https://ieeexplore.ieee.org/document/8617552

UR - http://www.scopus.com/inward/record.url?scp=85061816491&partnerID=8YFLogxK

U2 - 10.23919/APMC.2018.8617552

DO - 10.23919/APMC.2018.8617552

M3 - Article in conference proceedings

SN - 978-1-5386-2184-4

T3 - Asia-Pacific Microwave Conference Proceedings, APMC

SP - 1315

EP - 1317

BT - 2018 Asia-Pacific Microwave Conference, APMC 2018 - Proceedings

PB - IEEE - Institute of Electrical and Electronics Engineers Inc.

CY - Piscataway

T2 - 30th Asia-Pacific Microwave Conference 2018

Y2 - 6 November 2018 through 9 November 2018

ER -

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DOI