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Non-destructive transmissive inductive thickness sensor for IoT applications

Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review

Standard

Non-destructive transmissive inductive thickness sensor for IoT applications. / Bouattour, Ghada; Trigona, Carlo; Jmeaa Derbel, Houda Ben et al.
2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1203-1207 8570707 (2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018).

Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review

Harvard

Bouattour, G, Trigona, C, Jmeaa Derbel, HB, Baglio, S, Rosa, RL & Kanoun, O 2018, Non-destructive transmissive inductive thickness sensor for IoT applications. in 2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018., 8570707, 2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018, Institute of Electrical and Electronics Engineers Inc., pp. 1203-1207, 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018, Yassmine, Hammamet, Tunisia, 19.03.18. https://doi.org/10.1109/SSD.2018.8570707

APA

Bouattour, G., Trigona, C., Jmeaa Derbel, H. B., Baglio, S., Rosa, R. L., & Kanoun, O. (2018). Non-destructive transmissive inductive thickness sensor for IoT applications. In 2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018 (pp. 1203-1207). Article 8570707 (2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SSD.2018.8570707

Vancouver

Bouattour G, Trigona C, Jmeaa Derbel HB, Baglio S, Rosa RL, Kanoun O. Non-destructive transmissive inductive thickness sensor for IoT applications. In 2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1203-1207. 8570707. (2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018). doi: 10.1109/SSD.2018.8570707

Bibtex

@inbook{840c77fc570b441c81380728d9533af2,
title = "Non-destructive transmissive inductive thickness sensor for IoT applications",
abstract = "Inductive sensors have decisive advantages considering simplicity of implementation, low cost and usability in harsh environments. In this paper, we present a concept of a non-destructive transmissive inductive film thickness sensor for IoT applications. The sensor is based on a transformer principle composed of a fixed sending side using a multi-coil system and one receiving sensor coil. It measures the distance between two objects or the thickness of nonferromagnetic target materials. The sensor coil at the receiving side is battery-less, can be flexibly placed and is connected to a conditioning circuit and a low energy Bluetooth board (STEVAL-IDB007Vl), which starts automatically and sends the sensor output to a smartphone or a tablet. The measurement data are monitored by using a specially developed APP. Experimental results show that the sensor measures film thicknesses up to 1.2 cm with a sensitivity of about 0.032 V/mm and a resolution of 0.3 mm. Thereby a noise level of about 9.6 mV is recorded.",
keywords = "Android App, Inductive sensor, IoT, Multi-coil system, Sensor, Thickness measurement, Engineering",
author = "Ghada Bouattour and Carlo Trigona and {Jmeaa Derbel}, {Houda Ben} and Salvatore Baglio and Rosa, {Roberto La} and Olfa Kanoun",
note = "Funding Information: ACKNOWLEDGMENT This work is under a cooperation between the National School of Engineering of Sfax in Tunisia and the Technical University of Chemnitz in Germany. The authors would like to convey thanks to the TU Chemnitz for hosting them. They would like also to thank the DAAD foundation for supporting their work within the Research Training Group for Intelligent Embedded Sensor Solutions (RTG-ESS). Publisher Copyright: {\textcopyright} 2018 IEEE.; 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018 ; Conference date: 19-03-2018 Through 22-03-2018",
year = "2018",
month = dec,
day = "7",
doi = "10.1109/SSD.2018.8570707",
language = "English",
isbn = "978-1-5386-5306-7",
series = "2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1203--1207",
booktitle = "2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018",
address = "United States",
url = "https://ieeexplore.ieee.org/document/8570372, https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8570372",

}

RIS

TY - CHAP

T1 - Non-destructive transmissive inductive thickness sensor for IoT applications

AU - Bouattour, Ghada

AU - Trigona, Carlo

AU - Jmeaa Derbel, Houda Ben

AU - Baglio, Salvatore

AU - Rosa, Roberto La

AU - Kanoun, Olfa

N1 - Funding Information: ACKNOWLEDGMENT This work is under a cooperation between the National School of Engineering of Sfax in Tunisia and the Technical University of Chemnitz in Germany. The authors would like to convey thanks to the TU Chemnitz for hosting them. They would like also to thank the DAAD foundation for supporting their work within the Research Training Group for Intelligent Embedded Sensor Solutions (RTG-ESS). Publisher Copyright: © 2018 IEEE.

PY - 2018/12/7

Y1 - 2018/12/7

N2 - Inductive sensors have decisive advantages considering simplicity of implementation, low cost and usability in harsh environments. In this paper, we present a concept of a non-destructive transmissive inductive film thickness sensor for IoT applications. The sensor is based on a transformer principle composed of a fixed sending side using a multi-coil system and one receiving sensor coil. It measures the distance between two objects or the thickness of nonferromagnetic target materials. The sensor coil at the receiving side is battery-less, can be flexibly placed and is connected to a conditioning circuit and a low energy Bluetooth board (STEVAL-IDB007Vl), which starts automatically and sends the sensor output to a smartphone or a tablet. The measurement data are monitored by using a specially developed APP. Experimental results show that the sensor measures film thicknesses up to 1.2 cm with a sensitivity of about 0.032 V/mm and a resolution of 0.3 mm. Thereby a noise level of about 9.6 mV is recorded.

AB - Inductive sensors have decisive advantages considering simplicity of implementation, low cost and usability in harsh environments. In this paper, we present a concept of a non-destructive transmissive inductive film thickness sensor for IoT applications. The sensor is based on a transformer principle composed of a fixed sending side using a multi-coil system and one receiving sensor coil. It measures the distance between two objects or the thickness of nonferromagnetic target materials. The sensor coil at the receiving side is battery-less, can be flexibly placed and is connected to a conditioning circuit and a low energy Bluetooth board (STEVAL-IDB007Vl), which starts automatically and sends the sensor output to a smartphone or a tablet. The measurement data are monitored by using a specially developed APP. Experimental results show that the sensor measures film thicknesses up to 1.2 cm with a sensitivity of about 0.032 V/mm and a resolution of 0.3 mm. Thereby a noise level of about 9.6 mV is recorded.

KW - Android App

KW - Inductive sensor

KW - IoT

KW - Multi-coil system

KW - Sensor

KW - Thickness measurement

KW - Engineering

UR - http://www.scopus.com/inward/record.url?scp=85060597133&partnerID=8YFLogxK

U2 - 10.1109/SSD.2018.8570707

DO - 10.1109/SSD.2018.8570707

M3 - Article in conference proceedings

AN - SCOPUS:85060597133

SN - 978-1-5386-5306-7

T3 - 2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018

SP - 1203

EP - 1207

BT - 2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018

Y2 - 19 March 2018 through 22 March 2018

ER -

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Research output: Journal contributions › Journal articles › Research › peer-review

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Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review

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Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review

DOI