Non-destructive transmissive inductive thickness sensor for IoT applications
Publikation: Beiträge in Sammelwerken › Aufsätze in Konferenzbänden › Forschung › begutachtet
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Non-destructive transmissive inductive thickness sensor for IoT applications. / Bouattour, Ghada; Trigona, Carlo; Jmeaa Derbel, Houda Ben et al.
2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018. Institute of Electrical and Electronics Engineers Inc., 2018. S. 1203-1207 8570707 (2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018).Publikation: Beiträge in Sammelwerken › Aufsätze in Konferenzbänden › Forschung › begutachtet
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TY - CHAP
T1 - Non-destructive transmissive inductive thickness sensor for IoT applications
AU - Bouattour, Ghada
AU - Trigona, Carlo
AU - Jmeaa Derbel, Houda Ben
AU - Baglio, Salvatore
AU - Rosa, Roberto La
AU - Kanoun, Olfa
N1 - Funding Information: ACKNOWLEDGMENT This work is under a cooperation between the National School of Engineering of Sfax in Tunisia and the Technical University of Chemnitz in Germany. The authors would like to convey thanks to the TU Chemnitz for hosting them. They would like also to thank the DAAD foundation for supporting their work within the Research Training Group for Intelligent Embedded Sensor Solutions (RTG-ESS). Publisher Copyright: © 2018 IEEE.
PY - 2018/12/7
Y1 - 2018/12/7
N2 - Inductive sensors have decisive advantages considering simplicity of implementation, low cost and usability in harsh environments. In this paper, we present a concept of a non-destructive transmissive inductive film thickness sensor for IoT applications. The sensor is based on a transformer principle composed of a fixed sending side using a multi-coil system and one receiving sensor coil. It measures the distance between two objects or the thickness of nonferromagnetic target materials. The sensor coil at the receiving side is battery-less, can be flexibly placed and is connected to a conditioning circuit and a low energy Bluetooth board (STEVAL-IDB007Vl), which starts automatically and sends the sensor output to a smartphone or a tablet. The measurement data are monitored by using a specially developed APP. Experimental results show that the sensor measures film thicknesses up to 1.2 cm with a sensitivity of about 0.032 V/mm and a resolution of 0.3 mm. Thereby a noise level of about 9.6 mV is recorded.
AB - Inductive sensors have decisive advantages considering simplicity of implementation, low cost and usability in harsh environments. In this paper, we present a concept of a non-destructive transmissive inductive film thickness sensor for IoT applications. The sensor is based on a transformer principle composed of a fixed sending side using a multi-coil system and one receiving sensor coil. It measures the distance between two objects or the thickness of nonferromagnetic target materials. The sensor coil at the receiving side is battery-less, can be flexibly placed and is connected to a conditioning circuit and a low energy Bluetooth board (STEVAL-IDB007Vl), which starts automatically and sends the sensor output to a smartphone or a tablet. The measurement data are monitored by using a specially developed APP. Experimental results show that the sensor measures film thicknesses up to 1.2 cm with a sensitivity of about 0.032 V/mm and a resolution of 0.3 mm. Thereby a noise level of about 9.6 mV is recorded.
KW - Android App
KW - Inductive sensor
KW - IoT
KW - Multi-coil system
KW - Sensor
KW - Thickness measurement
KW - Engineering
UR - http://www.scopus.com/inward/record.url?scp=85060597133&partnerID=8YFLogxK
U2 - 10.1109/SSD.2018.8570707
DO - 10.1109/SSD.2018.8570707
M3 - Article in conference proceedings
AN - SCOPUS:85060597133
SN - 978-1-5386-5306-7
T3 - 2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018
SP - 1203
EP - 1207
BT - 2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018
Y2 - 19 March 2018 through 22 March 2018
ER -