Non-destructive transmissive inductive thickness sensor for IoT applications
Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review
Authors
Inductive sensors have decisive advantages considering simplicity of implementation, low cost and usability in harsh environments. In this paper, we present a concept of a non-destructive transmissive inductive film thickness sensor for IoT applications. The sensor is based on a transformer principle composed of a fixed sending side using a multi-coil system and one receiving sensor coil. It measures the distance between two objects or the thickness of nonferromagnetic target materials. The sensor coil at the receiving side is battery-less, can be flexibly placed and is connected to a conditioning circuit and a low energy Bluetooth board (STEVAL-IDB007Vl), which starts automatically and sends the sensor output to a smartphone or a tablet. The measurement data are monitored by using a specially developed APP. Experimental results show that the sensor measures film thicknesses up to 1.2 cm with a sensitivity of about 0.032 V/mm and a resolution of 0.3 mm. Thereby a noise level of about 9.6 mV is recorded.
Original language | English |
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Title of host publication | 2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018 |
Number of pages | 5 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Publication date | 07.12.2018 |
Pages | 1203-1207 |
Article number | 8570707 |
ISBN (print) | 978-1-5386-5306-7 |
ISBN (electronic) | 978-1-5386-5305-0, 978-1-5386-5304-3 |
DOIs | |
Publication status | Published - 07.12.2018 |
Externally published | Yes |
Event | 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018 - Yassmine, Hammamet, Tunisia Duration: 19.03.2018 → 22.03.2018 https://ieeexplore.ieee.org/document/8570372 https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8570372 |
Bibliographical note
Funding Information:
ACKNOWLEDGMENT This work is under a cooperation between the National School of Engineering of Sfax in Tunisia and the Technical University of Chemnitz in Germany. The authors would like to convey thanks to the TU Chemnitz for hosting them. They would like also to thank the DAAD foundation for supporting their work within the Research Training Group for Intelligent Embedded Sensor Solutions (RTG-ESS).
Publisher Copyright:
© 2018 IEEE.
- Android App, Inductive sensor, IoT, Multi-coil system, Sensor, Thickness measurement
- Engineering