Non-destructive transmissive inductive thickness sensor for IoT applications

Research output: Contributions to collected editions/worksArticle in conference proceedingsResearchpeer-review

Authors

  • Ghada Bouattour
  • Carlo Trigona
  • Houda Ben Jmeaa Derbel
  • Salvatore Baglio
  • Roberto La Rosa
  • Olfa Kanoun

Inductive sensors have decisive advantages considering simplicity of implementation, low cost and usability in harsh environments. In this paper, we present a concept of a non-destructive transmissive inductive film thickness sensor for IoT applications. The sensor is based on a transformer principle composed of a fixed sending side using a multi-coil system and one receiving sensor coil. It measures the distance between two objects or the thickness of nonferromagnetic target materials. The sensor coil at the receiving side is battery-less, can be flexibly placed and is connected to a conditioning circuit and a low energy Bluetooth board (STEVAL-IDB007Vl), which starts automatically and sends the sensor output to a smartphone or a tablet. The measurement data are monitored by using a specially developed APP. Experimental results show that the sensor measures film thicknesses up to 1.2 cm with a sensitivity of about 0.032 V/mm and a resolution of 0.3 mm. Thereby a noise level of about 9.6 mV is recorded.

Original languageEnglish
Title of host publication2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018
Number of pages5
PublisherInstitute of Electrical and Electronics Engineers Inc.
Publication date07.12.2018
Pages1203-1207
Article number8570707
ISBN (print)978-1-5386-5306-7
ISBN (electronic)978-1-5386-5305-0, 978-1-5386-5304-3
DOIs
Publication statusPublished - 07.12.2018
Externally publishedYes
Event15th International Multi-Conference on Systems, Signals and Devices, SSD 2018 - Yassmine, Hammamet, Tunisia
Duration: 19.03.201822.03.2018
https://ieeexplore.ieee.org/document/8570372
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8570372

Bibliographical note

Funding Information:
ACKNOWLEDGMENT This work is under a cooperation between the National School of Engineering of Sfax in Tunisia and the Technical University of Chemnitz in Germany. The authors would like to convey thanks to the TU Chemnitz for hosting them. They would like also to thank the DAAD foundation for supporting their work within the Research Training Group for Intelligent Embedded Sensor Solutions (RTG-ESS).

Publisher Copyright:
© 2018 IEEE.

    Research areas

  • Android App, Inductive sensor, IoT, Multi-coil system, Sensor, Thickness measurement
  • Engineering

DOI

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