Non-destructive transmissive inductive thickness sensor for IoT applications

Publikation: Beiträge in SammelwerkenAufsätze in KonferenzbändenForschungbegutachtet

Authors

  • Ghada Bouattour
  • Carlo Trigona
  • Houda Ben Jmeaa Derbel
  • Salvatore Baglio
  • Roberto La Rosa
  • Olfa Kanoun

Inductive sensors have decisive advantages considering simplicity of implementation, low cost and usability in harsh environments. In this paper, we present a concept of a non-destructive transmissive inductive film thickness sensor for IoT applications. The sensor is based on a transformer principle composed of a fixed sending side using a multi-coil system and one receiving sensor coil. It measures the distance between two objects or the thickness of nonferromagnetic target materials. The sensor coil at the receiving side is battery-less, can be flexibly placed and is connected to a conditioning circuit and a low energy Bluetooth board (STEVAL-IDB007Vl), which starts automatically and sends the sensor output to a smartphone or a tablet. The measurement data are monitored by using a specially developed APP. Experimental results show that the sensor measures film thicknesses up to 1.2 cm with a sensitivity of about 0.032 V/mm and a resolution of 0.3 mm. Thereby a noise level of about 9.6 mV is recorded.

OriginalspracheEnglisch
Titel2018 15th International Multi-Conference on Systems, Signals and Devices, SSD 2018
Anzahl der Seiten5
VerlagInstitute of Electrical and Electronics Engineers Inc.
Erscheinungsdatum07.12.2018
Seiten1203-1207
Aufsatznummer8570707
ISBN (Print)978-1-5386-5306-7
ISBN (elektronisch)978-1-5386-5305-0, 978-1-5386-5304-3
DOIs
PublikationsstatusErschienen - 07.12.2018
Extern publiziertJa
Veranstaltung15th International Multi-Conference on Systems, Signals and Devices, SSD 2018 - Yassmine, Hammamet, Tunesien
Dauer: 19.03.201822.03.2018
https://ieeexplore.ieee.org/document/8570372
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8570372

Bibliographische Notiz

Publisher Copyright:
© 2018 IEEE.

DOI

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