Integrative inspection methodology for enhanced PCB remanufacturing using artificial intelligence
Publikation: Beiträge in Zeitschriften › Konferenzaufsätze in Fachzeitschriften › Forschung › begutachtet
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in: Procedia CIRP, Jahrgang 132, 2025, S. 227-232.
Publikation: Beiträge in Zeitschriften › Konferenzaufsätze in Fachzeitschriften › Forschung › begutachtet
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TY - JOUR
T1 - Integrative inspection methodology for enhanced PCB remanufacturing using artificial intelligence
AU - Stamer, Florian
AU - Jachemich, Rouven
AU - Puttero, Stefano
AU - Verna, Elisa
AU - Galetto, Maurizio
N1 - Conference code: 12
PY - 2025
Y1 - 2025
N2 - Electronic waste (e-waste) represents one of the world's most significant environmental challenges, with over 50 million tons generated annually. A key component is the management of Printed Circuit Boards (PCBs), which are integral components of electronic devices and have an operational lifespan of 15 years. However, on average, electrical equipment is discarded after 5 years due to individual defects, prompting the EU to enforce regulations supporting the right to repair. Although industrial remanufacturing of PCBs could be a viable solution, it is not currently feasible due to the complex inspection process required. This paper presents a novel inspection process approach based on data fusion of thermography, current measurement and optical inspection using artificial intelligence. The result is intelligent diagnostics in less time and with lower investment costs. In addition to the concept, initial investigations with real industrial applications in the field of automation are presented.
AB - Electronic waste (e-waste) represents one of the world's most significant environmental challenges, with over 50 million tons generated annually. A key component is the management of Printed Circuit Boards (PCBs), which are integral components of electronic devices and have an operational lifespan of 15 years. However, on average, electrical equipment is discarded after 5 years due to individual defects, prompting the EU to enforce regulations supporting the right to repair. Although industrial remanufacturing of PCBs could be a viable solution, it is not currently feasible due to the complex inspection process required. This paper presents a novel inspection process approach based on data fusion of thermography, current measurement and optical inspection using artificial intelligence. The result is intelligent diagnostics in less time and with lower investment costs. In addition to the concept, initial investigations with real industrial applications in the field of automation are presented.
KW - Artificial Intelligence
KW - E-Waste Management
KW - Printed Circuit Board (PCB)
KW - Sustainable Manufacturing
KW - Engineering
UR - http://www.scopus.com/inward/record.url?scp=105000014769&partnerID=8YFLogxK
U2 - 10.1016/j.procir.2025.01.038
DO - 10.1016/j.procir.2025.01.038
M3 - Conference article in journal
AN - SCOPUS:105000014769
VL - 132
SP - 227
EP - 232
JO - Procedia CIRP
JF - Procedia CIRP
SN - 2212-8271
T2 - 12th CIRP Global Web Conference - CIRPe 2024
Y2 - 22 October 2024 through 23 October 2024
ER -