Compression behavior of typical silicone rubbers for soft robotics applications at elevated temperatures
Publikation: Beiträge in Sammelwerken › Aufsätze in Konferenzbänden › Forschung › begutachtet
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Compression behavior of typical silicone rubbers for soft robotics applications at elevated temperatures. / Utkan, Doruk; Maruthavanan, Duraikannan; Schimanowski, Alex et al.
2021 IEEE 4th International Conference on Soft Robotics, RoboSoft 2021. Institute of Electrical and Electronics Engineers Inc., 2021. S. 539-542 9479351 (2021 IEEE 4th International Conference on Soft Robotics, RoboSoft 2021).Publikation: Beiträge in Sammelwerken › Aufsätze in Konferenzbänden › Forschung › begutachtet
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TY - CHAP
T1 - Compression behavior of typical silicone rubbers for soft robotics applications at elevated temperatures
AU - Utkan, Doruk
AU - Maruthavanan, Duraikannan
AU - Schimanowski, Alex
AU - Seibel, Arthur
N1 - Conference code: 4
PY - 2021/4/12
Y1 - 2021/4/12
N2 - In this communication, we analyze the compression behavior of typical silicone rubbers used in soft robotics applications at elevated temperatures. In particular, compression experiments according to ISO 7743 are performed with three mixing ratios (base polymer to curing agent) of Sylgard, Elastosil, and Ecoflex at 24 °C (room temperature), 30 °C, 40 °C, 50 °C, and 60 °C. Furthermore, typical hyperelastic material models are fitted to the measured stress-strain curves for room temperature. It is shown that the (third-order) Yeoh model shows the best overall fit, and the corresponding model parameters are stated.
AB - In this communication, we analyze the compression behavior of typical silicone rubbers used in soft robotics applications at elevated temperatures. In particular, compression experiments according to ISO 7743 are performed with three mixing ratios (base polymer to curing agent) of Sylgard, Elastosil, and Ecoflex at 24 °C (room temperature), 30 °C, 40 °C, 50 °C, and 60 °C. Furthermore, typical hyperelastic material models are fitted to the measured stress-strain curves for room temperature. It is shown that the (third-order) Yeoh model shows the best overall fit, and the corresponding model parameters are stated.
KW - Engineering
UR - http://www.scopus.com/inward/record.url?scp=85111334335&partnerID=8YFLogxK
UR - https://www.mendeley.com/catalogue/e0fd8142-a1b8-3186-bd9f-c25fd3af8910/
U2 - 10.1109/RoboSoft51838.2021.9479351
DO - 10.1109/RoboSoft51838.2021.9479351
M3 - Article in conference proceedings
AN - SCOPUS:85111334335
SN - 978-1-7281-7714-4
T3 - 2021 IEEE 4th International Conference on Soft Robotics, RoboSoft 2021
SP - 539
EP - 542
BT - 2021 IEEE 4th International Conference on Soft Robotics, RoboSoft 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th IEEE International Conference on Soft Robotics, RoboSoft 2021
Y2 - 12 April 2021 through 16 April 2021
ER -