Investigation on the Microstructure and Mechanical Properties of Mg–Gd–Nd Ternary Alloys
Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review
Authors
The present work deals with microstructure and mechanical properties of Mg–xGd–yNd (x = 10, 15; y = 2, 5) ternary alloys. Hardness, tensile, and compressive properties are measured on the as-cast alloys and the alloys after solid solution treatment (T4 state). The hardness, tensile yield stress (TYS), and ultimate tensile stress (UTS) are increased with increasing amount of alloying elements for both as-cast and T4 state. The elongation (El) of alloys is lower with higher Nd content. The compressive properties of all studied alloys are increased by T4 treatment. With increasing of alloy concentration, both compressive yield stress (CYS) and ultimate compressive stress (UCS) of alloys are enhanced, but the compressibility is decreased. Intermetallic compounds which appear along the grain boundary are reduced after T4 treatment for alloys with 2% Nd. However, large amount of intermetallic compounds with high Nd concentrations remains on the grain boundary of Mg–xGd–5Nd alloys.
Original language | English |
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Title of host publication | Magnesium Technology 2020 |
Editors | J. Brian Jordon, Victoria Miller, Vineet V. Joshi, Neale R. Neelameggham |
Number of pages | 7 |
Place of Publication | Cham |
Publisher | Springer Schweiz |
Publication date | 2020 |
Pages | 79-85 |
ISBN (print) | 978-3-030-36647-6 |
ISBN (electronic) | 978-3-030-36646-9 |
DOIs | |
Publication status | Published - 2020 |
Externally published | Yes |
Event | Magnesium Technology Symposium held at the 149th Annual Meeting and Exhibition - TMS 2020 - San Diego, United States Duration: 23.02.2020 → 27.02.2020 Conference number: 149 https://www.tms.org/TMS2020/Featured_Sessions/Magnesium_Technology/TMS2020/featured/Magnesium_Technology_2020_Keynote_Session.aspx?hkey=d697f510-38d1-4006-9d33-671260e64873 |
- Mechanical properties, Mg–RE alloy, Microstructure
- Engineering