Deformation and Anchoring of AA 2024-T3 rivets within thin printed circuit boards
Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review
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ESAFORM 2021: 24th International Conference on Material Forming. Liège: ULiège Library, 2021. 21.4327 (ESAFORM 2021).
Research output: Contributions to collected editions/works › Article in conference proceedings › Research › peer-review
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TY - CHAP
T1 - Deformation and Anchoring of AA 2024-T3 rivets within thin printed circuit boards
AU - Antunes Viallas Boas, Maria ClaraFarah
AU - Rodrigues, Camila Fernanda
AU - Blaga, Lucian Attila
AU - dos Santos, Jorge Fernandez
AU - Klusemann, Benjamin
N1 - Conference code: 24
PY - 2021/4/1
Y1 - 2021/4/1
N2 - This work evaluates the viability of applying Friction Riveting as an alternative for the assembly of components on printed circuit boards (PCBs). The popular press-fit technology for assembling components on PCBs consists of a pin inserted tightly into a relatively smaller hole, resulting in good electrical andmechanical properties. However, some limitations are highlighted, such as numerous processing steps and the need for predrilled holes. Friction Riveting is based on mechanical fastening and friction welding principles, where polymeric components are joined with metallic rivets through frictional heating and pressure. The main benefits of using Friction Riveting in PCBs compared with fit-press are (i) a reduced number of processing steps and (ii) shorter joining cycles, because there is no pre-drilling involved with fasteners anchored within the PCBin a single step. The joints were manufactured using 5 mm diameter AA-2024-T3 rivets and 1.5 mm thick glassfiber-reinforced epoxy laminates (FR4-PCB). It is shown for the first time that it is possible to deform metallic rivets within thin composite plates at a reduced diameterto-thickness ratio. The feasibility study followed a one-factor-a-time approach for parameter screening and optical microscopy assessed joint formation of the deformed rivets inside the laminates through volumetric ratio (VR). The joints present significant deformation(VR=0.5) at the tip of the rivet inserted into overlapped PCBs plates, with thicknesses below 3.0 mm, which is considered the lowest achieved so far with Friction Riveting.
AB - This work evaluates the viability of applying Friction Riveting as an alternative for the assembly of components on printed circuit boards (PCBs). The popular press-fit technology for assembling components on PCBs consists of a pin inserted tightly into a relatively smaller hole, resulting in good electrical andmechanical properties. However, some limitations are highlighted, such as numerous processing steps and the need for predrilled holes. Friction Riveting is based on mechanical fastening and friction welding principles, where polymeric components are joined with metallic rivets through frictional heating and pressure. The main benefits of using Friction Riveting in PCBs compared with fit-press are (i) a reduced number of processing steps and (ii) shorter joining cycles, because there is no pre-drilling involved with fasteners anchored within the PCBin a single step. The joints were manufactured using 5 mm diameter AA-2024-T3 rivets and 1.5 mm thick glassfiber-reinforced epoxy laminates (FR4-PCB). It is shown for the first time that it is possible to deform metallic rivets within thin composite plates at a reduced diameterto-thickness ratio. The feasibility study followed a one-factor-a-time approach for parameter screening and optical microscopy assessed joint formation of the deformed rivets inside the laminates through volumetric ratio (VR). The joints present significant deformation(VR=0.5) at the tip of the rivet inserted into overlapped PCBs plates, with thicknesses below 3.0 mm, which is considered the lowest achieved so far with Friction Riveting.
KW - Engineering
KW - Friction riveting
KW - Hybrid thermoset-metal joints
KW - Joint formation
KW - Mechanical anchoring
KW - Printed circuit board
UR - http://www.scopus.com/inward/record.url?scp=85119346782&partnerID=8YFLogxK
UR - https://www.mendeley.com/catalogue/db861d0c-b9e5-3be1-a2ae-c60f06190d68/
U2 - 10.25518/esaform21.4327
DO - 10.25518/esaform21.4327
M3 - Article in conference proceedings
SN - 978-2-87019-302-0
T3 - ESAFORM 2021
BT - ESAFORM 2021
PB - ULiège Library
CY - Liège
T2 - 24th International Conference on Material Forming - ESAFORM 2021
Y2 - 14 April 2021 through 16 April 2021
ER -