TY - CHAP

T1 - Deformation and Anchoring of AA 2024-T3 rivets within thin printed circuit boards

AU - Antunes Viallas Boas, Maria ClaraFarah

AU - Rodrigues, Camila Fernanda

AU - Blaga, Lucian Attila

AU - dos Santos, Jorge Fernandez

AU - Klusemann, Benjamin

N1 - Conference code: 24

PY - 2021/4/1

Y1 - 2021/4/1

N2 - This work evaluates the viability of applying Friction Riveting as an alternative for the assembly of components on printed circuit boards (PCBs). The popular press-fit technology for assembling components on PCBs consists of a pin inserted tightly into a relatively smaller hole, resulting in good electrical andmechanical properties. However, some limitations are highlighted, such as numerous processing steps and the need for predrilled holes. Friction Riveting is based on mechanical fastening and friction welding principles, where polymeric components are joined with metallic rivets through frictional heating and pressure. The main benefits of using Friction Riveting in PCBs compared with fit-press are (i) a reduced number of processing steps and (ii) shorter joining cycles, because there is no pre-drilling involved with fasteners anchored within the PCBin a single step. The joints were manufactured using 5 mm diameter AA-2024-T3 rivets and 1.5 mm thick glassfiber-reinforced epoxy laminates (FR4-PCB). It is shown for the first time that it is possible to deform metallic rivets within thin composite plates at a reduced diameterto-thickness ratio. The feasibility study followed a one-factor-a-time approach for parameter screening and optical microscopy assessed joint formation of the deformed rivets inside the laminates through volumetric ratio (VR). The joints present significant deformation(VR=0.5) at the tip of the rivet inserted into overlapped PCBs plates, with thicknesses below 3.0 mm, which is considered the lowest achieved so far with Friction Riveting.

AB - This work evaluates the viability of applying Friction Riveting as an alternative for the assembly of components on printed circuit boards (PCBs). The popular press-fit technology for assembling components on PCBs consists of a pin inserted tightly into a relatively smaller hole, resulting in good electrical andmechanical properties. However, some limitations are highlighted, such as numerous processing steps and the need for predrilled holes. Friction Riveting is based on mechanical fastening and friction welding principles, where polymeric components are joined with metallic rivets through frictional heating and pressure. The main benefits of using Friction Riveting in PCBs compared with fit-press are (i) a reduced number of processing steps and (ii) shorter joining cycles, because there is no pre-drilling involved with fasteners anchored within the PCBin a single step. The joints were manufactured using 5 mm diameter AA-2024-T3 rivets and 1.5 mm thick glassfiber-reinforced epoxy laminates (FR4-PCB). It is shown for the first time that it is possible to deform metallic rivets within thin composite plates at a reduced diameterto-thickness ratio. The feasibility study followed a one-factor-a-time approach for parameter screening and optical microscopy assessed joint formation of the deformed rivets inside the laminates through volumetric ratio (VR). The joints present significant deformation(VR=0.5) at the tip of the rivet inserted into overlapped PCBs plates, with thicknesses below 3.0 mm, which is considered the lowest achieved so far with Friction Riveting.

KW - Engineering

KW - Friction riveting

KW - Hybrid thermoset-metal joints

KW - Joint formation

KW - Mechanical anchoring

KW - Printed circuit board

UR - http://www.scopus.com/inward/record.url?scp=85119346782&partnerID=8YFLogxK

UR - https://www.mendeley.com/catalogue/db861d0c-b9e5-3be1-a2ae-c60f06190d68/

U2 - 10.25518/esaform21.4327

DO - 10.25518/esaform21.4327

M3 - Article in conference proceedings

SN - 978-2-87019-302-0

T3 - ESAFORM 2021

BT - ESAFORM 2021

PB - ULiège Library

CY - Liège

T2 - 24th International Conference on Material Forming - ESAFORM 2021

Y2 - 14 April 2021 through 16 April 2021

ER -