TY - JOUR

T1 - Application of Friction Riveting technique for the assembly of electronic components on printed circuit boards (PCB)

AU - Rodrigues, Camila F.

AU - Boas, Maria C.Vilas

AU - Blaga, Lucian

AU - Bartz, Olaf

AU - Klusemann, Benjamin

N1 - Publisher Copyright: © The Author(s) 2024.

PY - 2024/7/1

Y1 - 2024/7/1

N2 - This study focuses on the effects of reducing the diameter of rivets used in Friction Riveting due to the need for downscaling when joining assemblies on a smaller scale. The Friction Riveting process has shown promising feasibility for a variety of material combinations and applications in the transportation industry. Recent research has explored the potential application of this technique in electronics, specifically for the assembly of printed circuit boards (PCBs), using AA-2024-T351 rivets on thin glass-fiber-reinforced epoxy substrates (FR4). The joint formation of joints produced with PCBs was investigated in terms of process temperature evolution, microstructural changes, and mechanical properties. Joints were obtained at process temperatures ranging from 285 ºC to 368 ºC. The use of 4 mm rivets resulted in extensive delamination, weak joint mechanisms, and cracking, impaired by the different coefficients of thermal expansion of the materials involved. Reducing the rivet diameter to 3 mm significantly improved joint quality. A further reduction to 2.5 mm minimized delamination but led to insufficient anchorage and cracking. Joints produced with a 3 mm rivet diameter achieved the highest ultimate tensile force of 276 N. This study sets the foundation for applying the Friction Riveting process to practical PCB assemblies, demonstrating that optimizing the process parameters to the diameter-to-thickness ratio can balance sufficient rivet anchoring, minimize delamination, and reduce cracking.

AB - This study focuses on the effects of reducing the diameter of rivets used in Friction Riveting due to the need for downscaling when joining assemblies on a smaller scale. The Friction Riveting process has shown promising feasibility for a variety of material combinations and applications in the transportation industry. Recent research has explored the potential application of this technique in electronics, specifically for the assembly of printed circuit boards (PCBs), using AA-2024-T351 rivets on thin glass-fiber-reinforced epoxy substrates (FR4). The joint formation of joints produced with PCBs was investigated in terms of process temperature evolution, microstructural changes, and mechanical properties. Joints were obtained at process temperatures ranging from 285 ºC to 368 ºC. The use of 4 mm rivets resulted in extensive delamination, weak joint mechanisms, and cracking, impaired by the different coefficients of thermal expansion of the materials involved. Reducing the rivet diameter to 3 mm significantly improved joint quality. A further reduction to 2.5 mm minimized delamination but led to insufficient anchorage and cracking. Joints produced with a 3 mm rivet diameter achieved the highest ultimate tensile force of 276 N. This study sets the foundation for applying the Friction Riveting process to practical PCB assemblies, demonstrating that optimizing the process parameters to the diameter-to-thickness ratio can balance sufficient rivet anchoring, minimize delamination, and reduce cracking.

KW - Delamination

KW - Downscaling

KW - Friction Riveting

KW - Joint formation

KW - PCB

KW - Printed circuit board

KW - Engineering

UR - http://www.scopus.com/inward/record.url?scp=85197570303&partnerID=8YFLogxK

U2 - 10.1007/s00170-024-14054-0

DO - 10.1007/s00170-024-14054-0

M3 - Journal articles

AN - SCOPUS:85197570303

JO - International Journal of Advanced Manufacturing Technology

JF - International Journal of Advanced Manufacturing Technology

SN - 0268-3768

ER -