TY - CHAP

T1 - Solid state recycling of different chip types of aluminum alloy 6060 by hot extrusion

AU - Güley, V.

AU - Pantke, K.

AU - Ben Khalifa, Noomane

AU - Tekkaya, A. Erman

AU - Biermann, Dirk

N1 - Conference code: 1

PY - 2010

Y1 - 2010

N2 - This paper presents the recycling of aluminum chips by hot extrusion as an alternative to re-melting. Three different types of chips were produced from aluminum alloy 6060 material and then compacted into extrusion billets and hotextruded at 500 deg C to full 5 x 20 mm2 rectangular profiles. The tensile strength of the extruded profiles produced from the chips was on average 10% lower than the values of extruded profiles from as-cast material. In the case of one chip type an even higher ductility was achieved, which can be attributed to the density of the chip boundaries acting like grain boundaries. Also, the influence different chip types have on the machinability of the extruded profiles was investigated.

AB - This paper presents the recycling of aluminum chips by hot extrusion as an alternative to re-melting. Three different types of chips were produced from aluminum alloy 6060 material and then compacted into extrusion billets and hotextruded at 500 deg C to full 5 x 20 mm2 rectangular profiles. The tensile strength of the extruded profiles produced from the chips was on average 10% lower than the values of extruded profiles from as-cast material. In the case of one chip type an even higher ductility was achieved, which can be attributed to the density of the chip boundaries acting like grain boundaries. Also, the influence different chip types have on the machinability of the extruded profiles was investigated.

KW - Engineering

KW - Duktilität

KW - Einschluss

KW - Energieverbrauch

KW - Korngrenze

KW - Materialverlust

KW - mechanische Festigkeit

KW - Mikrogefüge

KW - Mikrohärte

KW - Oxidschicht

KW - Prozessparameter

KW - Recycling

KW - Schnittgeschwindigkeit

KW - schitttiefe

KW - Spanbarkeit

KW - Spandicke

KW - Spannungs-Dehnungs-Diagramm

KW - Vorschubgeschwindigkeit

KW - Warmpressen

KW - Zugfestigkeit

KW - Zugversuch

M3 - Article in conference proceedings

SN - 978-3-942267-04-5

T3 - Berichte aus dem IWU

SP - 775

EP - 790

BT - Sustainable Production for Resource Efficiency and Ecomobility

PB - Verlag Wissenschaftliche Scripten

T2 - 1st International Chemnitz Manufacturing Colloquium - ICMC 2010

Y2 - 29 September 2010 through 30 September 2010

ER -