TY - CHAP

T1 - Optical part measuring inside a milling machine

AU - Meier, Nicolas

AU - Georgiadis, Anthimos

N1 - Conference code: 11

PY - 2014

Y1 - 2014

N2 - The dimensions of a workpiece have been measured during the milling process using a 3D laser inspection system. Re-clamping of the work piece has been avoided but a short interruption of the milling process took place. All three dimensions of the part have been measured, height and width using a profile scanning devise based on the laser triangulation method and the length using also the displacement features of the machine tool. Gauge blocks with the reference dimension of 4, 8, 10, 14, 18 and 23 mm have been used for the verification of the measurements. The measured values for the height deviate from the real value between 0 to 19 μm. The deviations of the length lie between 0 and 33 μm. The deviations of the width are higher and they lie between 0 and 150 μm, because of the scanning steps of the devise. The measurement of the width could be improved using a second scanner perpendicular to the first one in order to achieve an overall part inspection with deviations lower than 33 μm.

AB - The dimensions of a workpiece have been measured during the milling process using a 3D laser inspection system. Re-clamping of the work piece has been avoided but a short interruption of the milling process took place. All three dimensions of the part have been measured, height and width using a profile scanning devise based on the laser triangulation method and the length using also the displacement features of the machine tool. Gauge blocks with the reference dimension of 4, 8, 10, 14, 18 and 23 mm have been used for the verification of the measurements. The measured values for the height deviate from the real value between 0 to 19 μm. The deviations of the length lie between 0 and 33 μm. The deviations of the width are higher and they lie between 0 and 150 μm, because of the scanning steps of the devise. The measurement of the width could be improved using a second scanner perpendicular to the first one in order to achieve an overall part inspection with deviations lower than 33 μm.

KW - Inprocess measurement

KW - Micro metrology

KW - Optical laser inspection system

KW - Profile measurement

KW - Zero defect manufacturing

KW - Engineering

UR - http://www.scopus.com/inward/record.url?scp=84902687787&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/KEM.613.440

DO - 10.4028/www.scientific.net/KEM.613.440

M3 - Article in conference proceedings

AN - SCOPUS:84902687787

SN - 9783038351122

T3 - Key Engineering Materials

SP - 440

EP - 445

BT - Measurement Technology and Intelligent Instruments XI

A2 - Schmitt, Robert

A2 - Bosse, Harald

PB - Trans Tech Publ.

T2 - 11th International Symposium on Measurement Technology and Intelligent Instruments - ISMTII 2013

Y2 - 2 July 2013 through 3 July 2013

ER -