Homogenization of the interfacial bonding of compound-cast AA7075/6060 bilayer billets by co-extrusion
Publikation: Beiträge in Zeitschriften › Zeitschriftenaufsätze › Forschung › begutachtet
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Homogenization of the interfacial bonding of compound-cast AA7075/6060 bilayer billets by co-extrusion. / Chen, Hui; Giannopoulou, Danai; Greß, Thomas et al.
in: International Journal of Material Forming, Jahrgang 14, Nr. 5, 09.2021, S. 1109-1119.Publikation: Beiträge in Zeitschriften › Zeitschriftenaufsätze › Forschung › begutachtet
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TY - JOUR
T1 - Homogenization of the interfacial bonding of compound-cast AA7075/6060 bilayer billets by co-extrusion
AU - Chen, Hui
AU - Giannopoulou, Danai
AU - Greß, Thomas
AU - Isakovic, Jonas
AU - Mittler, Tim
AU - Volk, Wolfram
AU - Ben Khalifa, Noomane
N1 - Open Access funding enabled and organized by Projekt DEAL. This study was funded by the German Research Foundation (DFG) [grant number BE5196/11 − 1].
PY - 2021/9
Y1 - 2021/9
N2 - A process chain of compound casting and co-extrusion of AA7075/6060 bilayer billets is introduced to manufacture hybrid components with strength in the core and good corrosion-resistance in the shell. Using optimized compound casting parameter, metallurgical bonding between the shell AA6060 and the core AA7075 can be achieved through remelting and recrystallization of the substrate AA7075. The locally unequal thermal conditions at the interface induces partially weak bonding. The bonding strength in greater distance from the casting gate is generally lower. Hot extrusion is applied to improve the interfacial bonding. Comparisons of the microstructure and the shear strength between as-cast billet and extrudate present the homogenization of the interfacial bonding through the process chain.
AB - A process chain of compound casting and co-extrusion of AA7075/6060 bilayer billets is introduced to manufacture hybrid components with strength in the core and good corrosion-resistance in the shell. Using optimized compound casting parameter, metallurgical bonding between the shell AA6060 and the core AA7075 can be achieved through remelting and recrystallization of the substrate AA7075. The locally unequal thermal conditions at the interface induces partially weak bonding. The bonding strength in greater distance from the casting gate is generally lower. Hot extrusion is applied to improve the interfacial bonding. Comparisons of the microstructure and the shear strength between as-cast billet and extrudate present the homogenization of the interfacial bonding through the process chain.
KW - Engineering
KW - compound casting
KW - co-extrusion
KW - bond strength
UR - http://www.scopus.com/inward/record.url?scp=85106015020&partnerID=8YFLogxK
U2 - 10.1007/s12289-021-01626-8
DO - 10.1007/s12289-021-01626-8
M3 - Journal articles
VL - 14
SP - 1109
EP - 1119
JO - International Journal of Material Forming
JF - International Journal of Material Forming
SN - 1960-6206
IS - 5
ER -