High quality extrudates from aluminum chips by new billet compaction and deformation routes

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High quality extrudates from aluminum chips by new billet compaction and deformation routes. / Misiolek, Wojciech Z.; Haase, Matthias; Ben Khalifa, Noomane et al.
in: CIRP Annals - Manufacturing Technology, Jahrgang 61, Nr. 1, 01.01.2012, S. 239-242.

Publikation: Beiträge in ZeitschriftenZeitschriftenaufsätzeForschungbegutachtet

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Misiolek WZ, Haase M, Ben Khalifa N, Tekkaya AE, Kleiner M. High quality extrudates from aluminum chips by new billet compaction and deformation routes. CIRP Annals - Manufacturing Technology. 2012 Jan 1;61(1):239-242. doi: 10.1016/j.cirp.2012.03.113

Bibtex

@article{18ab0996099a43dbada1b58a7dc076c0,
title = "High quality extrudates from aluminum chips by new billet compaction and deformation routes",
abstract = "The effects of different billet preparation techniques as well as selection of various deformation routes and their influence on the final mechanical properties in chip extrusion was studied. The AA6060 chips were compacted into billets using various techniques and then extruded through the flat-face, porthole and ECAP dies to create different deformation routes. The microstructures and the mechanical properties of the chip extruded profiles were compared to cast billets extruded through the flat-face die under the same conditions. The proposed technology shows very promising results in terms of energy savings and production of the high quality engineered aluminum profiles.",
keywords = "Chip, Die design, Extrusion, Engineering",
author = "Misiolek, {Wojciech Z.} and Matthias Haase and {Ben Khalifa}, Noomane and Tekkaya, {A. Erman} and Matthias Kleiner",
year = "2012",
month = jan,
day = "1",
doi = "10.1016/j.cirp.2012.03.113",
language = "English",
volume = "61",
pages = "239--242",
journal = "CIRP Annals - Manufacturing Technology",
issn = "0007-8506",
publisher = "Elsevier B.V.",
number = "1",

}

RIS

TY - JOUR

T1 - High quality extrudates from aluminum chips by new billet compaction and deformation routes

AU - Misiolek, Wojciech Z.

AU - Haase, Matthias

AU - Ben Khalifa, Noomane

AU - Tekkaya, A. Erman

AU - Kleiner, Matthias

PY - 2012/1/1

Y1 - 2012/1/1

N2 - The effects of different billet preparation techniques as well as selection of various deformation routes and their influence on the final mechanical properties in chip extrusion was studied. The AA6060 chips were compacted into billets using various techniques and then extruded through the flat-face, porthole and ECAP dies to create different deformation routes. The microstructures and the mechanical properties of the chip extruded profiles were compared to cast billets extruded through the flat-face die under the same conditions. The proposed technology shows very promising results in terms of energy savings and production of the high quality engineered aluminum profiles.

AB - The effects of different billet preparation techniques as well as selection of various deformation routes and their influence on the final mechanical properties in chip extrusion was studied. The AA6060 chips were compacted into billets using various techniques and then extruded through the flat-face, porthole and ECAP dies to create different deformation routes. The microstructures and the mechanical properties of the chip extruded profiles were compared to cast billets extruded through the flat-face die under the same conditions. The proposed technology shows very promising results in terms of energy savings and production of the high quality engineered aluminum profiles.

KW - Chip

KW - Die design

KW - Extrusion

KW - Engineering

UR - http://www.scopus.com/inward/record.url?scp=84861609384&partnerID=8YFLogxK

UR - https://www.mendeley.com/catalogue/b0c9b09a-f851-3525-ab9c-b1035b50380e/

U2 - 10.1016/j.cirp.2012.03.113

DO - 10.1016/j.cirp.2012.03.113

M3 - Journal articles

AN - SCOPUS:84861609384

VL - 61

SP - 239

EP - 242

JO - CIRP Annals - Manufacturing Technology

JF - CIRP Annals - Manufacturing Technology

SN - 0007-8506

IS - 1

ER -

DOI